The Three-Player DRAM StructureNarrow moat

SK hynix (SKHY) — moat facet

Three companies take more than nine-tenths of DRAM revenue, and that arithmetic -- not any technology -- is why memory became investable.

The most important fact about DRAM is not technological. It is that there are three companies left.

DRAM revenue, Q1 2026SK hynix — 29%Samsung and Micron — 62%Everyone else < — 9%IDC: the three producers together take more than 90% of DRAM revenue.
Three companies, ninety percent - the arithmetic that made memory investable.

Samsung, SK hynix and Micron together account for more than 90% of DRAM revenue1. That structure was not designed; it is what remained after two decades in which memory makers competed each other into losses and then into bankruptcy or merger. SK hynix itself is a product of that process — it exists because Hyundai and LG's memory businesses combined, nearly failed, and were rescued.

What three players buys is not the ability to raise prices at will. It is something narrower and more useful: when demand falls, three companies can each cut output and watch the price stabilise, whereas thirty companies each cut output hoping the others do too, and none of them does. Discipline is possible with three participants in a way it is arithmetically not possible with thirty.

SK hynix sits second in this structure with 29.1% of the market2. Second is a genuinely good place to be in an oligopoly — big enough to matter to the price, not so big that the industry's problems are entirely yours to solve.

The caution is that oligopoly discipline is behavioural, not structural. It assumes every participant is trying to earn a return. In 2023 the discipline failed and SK hynix lost ₩9.1 trillion3; revenue was ₩32,766 billion against ₩33,299 billion of cost of sales4 because the three of them kept producing into a collapsing market.

Watch the number of DRAM makers with meaningful share. Three is a moat. Four is a price war, and the fourth is being funded in China.

Moat trajectory: Narrowing

Three producers still take more than 90% of DRAM revenue, but the filing now names CXMT among them, and a participant that does not require a competitive return changes what the structure is worth.

The number that tests this moat
Third-party estimate
Share of DRAM revenue held by three producers
>90% in Q1 2026

Samsung, SK hynix and Micron between them. That structure is the reason memory became investable at all — it shortens downturns rather than conferring pricing power. The number to watch is not this one but whether a fourth participant starts appearing in it.

IDC estimate, quoted by SK hynix in its prospectus.
Source: SK hynix Form 424B4 prospectus (10 July 2026) ↗
Aspects of the moat
⚠ Threats to the moat
References
  1. Third-party estimateSamsung, SK hynix and Micron together account for more than 90% of DRAM revenue.
    SK hynix Inc., Form 424B4 prospectus for its Nasdaq offering (SEC, CIK 2120882) — FY2025 revenue W 97,147bn, cost of sales W 38,456bn, gross profit W 58,691bn, S&A W 5,019bn, R&D W 6,466bn and profit for the year W 42,948bn, against FY2024 revenue W 66,193bn / profit W 19,797bn and FY2023 revenue W 32,766bn / cost of sales W 33,299bn / gross loss W 533bn / loss for the year W 9,138bn; Q1 2026 revenue W 52,576bn, gross profit W 41,679bn, profit W 40,346bn. IDC market shares for Q1 2026: second in DRAM at 29.1%, first in HBM at 56.4%, second in NAND at 18.5%, with the three DRAM producers together above 90% of revenue. DRAM products were 77.1% of total sales in 2025 and 77.3% in Q1 2026; NAND 21.3% and 22.0%. Competitors named: Samsung Electronics, Micron Technology and CXMT in DRAM; Samsung Electronics, Kioxia, Micron Technology and Sandisk in NAND; competitive factors listed as 'pricing; manufacturing costs, yields and product availability; product performance, quality and reliability'. First to develop HBM using TSV packaging, commercialised HBM3E in 2024 and developed HBM4 in 2025; HBM carried a per-gigabyte price premium of more than five times traditional DRAM in 2025. M15X cleanroom opened October 2025 with wafer input from Q1 2026; Yongin construction began February 2025 with the first fab's phase-one cleanroom expected Q1 2027; an advanced packaging plant (P&T7) is under construction in Cheongju and one is planned in Indiana for the second half of 2028. Intel's NAND business cost US$6.6bn in December 2021 plus US$2.2bn in March 2025, operated as Solidigm; NAND mass production is transitioning from 176-layer to 238- and 321-layer technologies. Gartner forecasts DRAM revenue of US$143bn in 2025 rising to US$401bn in 2027, HBM US$33bn to US$86bn and NAND US$68bn to US$341bn. A substantial portion of sales is attributable to a limited number of customers located in the United States and China; the two largest were 14.8% and 12.4% of revenue in Q1 2026 and the largest was 23.9% of revenue in 2025. The offering was 177,900,000 ADSs at US$149.00, each ADS one-tenth of a common share, representing 17,790,000 shares against 712,702,365 outstanding; Baillie Gifford, Coatue and Situational Awareness Partners indicated non-binding interest of up to US$7bn. — FY2023-FY2025 and Q1 2026 · publ. 2026-07-10 · source ↗
  2. Third-party estimateSK hynix sits second in DRAM with 29.1% of the market.
    SK hynix Inc., Form 424B4 prospectus for its Nasdaq offering (SEC, CIK 2120882) — FY2025 revenue W 97,147bn, cost of sales W 38,456bn, gross profit W 58,691bn, S&A W 5,019bn, R&D W 6,466bn and profit for the year W 42,948bn, against FY2024 revenue W 66,193bn / profit W 19,797bn and FY2023 revenue W 32,766bn / cost of sales W 33,299bn / gross loss W 533bn / loss for the year W 9,138bn; Q1 2026 revenue W 52,576bn, gross profit W 41,679bn, profit W 40,346bn. IDC market shares for Q1 2026: second in DRAM at 29.1%, first in HBM at 56.4%, second in NAND at 18.5%, with the three DRAM producers together above 90% of revenue. DRAM products were 77.1% of total sales in 2025 and 77.3% in Q1 2026; NAND 21.3% and 22.0%. Competitors named: Samsung Electronics, Micron Technology and CXMT in DRAM; Samsung Electronics, Kioxia, Micron Technology and Sandisk in NAND; competitive factors listed as 'pricing; manufacturing costs, yields and product availability; product performance, quality and reliability'. First to develop HBM using TSV packaging, commercialised HBM3E in 2024 and developed HBM4 in 2025; HBM carried a per-gigabyte price premium of more than five times traditional DRAM in 2025. M15X cleanroom opened October 2025 with wafer input from Q1 2026; Yongin construction began February 2025 with the first fab's phase-one cleanroom expected Q1 2027; an advanced packaging plant (P&T7) is under construction in Cheongju and one is planned in Indiana for the second half of 2028. Intel's NAND business cost US$6.6bn in December 2021 plus US$2.2bn in March 2025, operated as Solidigm; NAND mass production is transitioning from 176-layer to 238- and 321-layer technologies. Gartner forecasts DRAM revenue of US$143bn in 2025 rising to US$401bn in 2027, HBM US$33bn to US$86bn and NAND US$68bn to US$341bn. A substantial portion of sales is attributable to a limited number of customers located in the United States and China; the two largest were 14.8% and 12.4% of revenue in Q1 2026 and the largest was 23.9% of revenue in 2025. The offering was 177,900,000 ADSs at US$149.00, each ADS one-tenth of a common share, representing 17,790,000 shares against 712,702,365 outstanding; Baillie Gifford, Coatue and Situational Awareness Partners indicated non-binding interest of up to US$7bn. — FY2023-FY2025 and Q1 2026 · publ. 2026-07-10 · source ↗
  3. ReportedSK hynix lost ₩9,138bn in 2023.
    SK hynix Inc., Form 424B4 prospectus — consolidated income statements and management's discussion (SEC, CIK 2120882). FY2025: revenue W 97,147bn, cost of sales W 38,456bn, gross profit W 58,691bn, selling and administrative expenses W 5,019bn, research and development W 6,466bn, profit for the year W 42,948bn. FY2024: revenue W 66,193bn, gross profit W 31,828bn, R&D W 4,436bn, profit W 19,797bn. FY2023: revenue W 32,766bn, cost of sales W 33,299bn, a gross loss of W 533bn, an operating loss of W 7,730bn and a loss for the year of W 9,138bn, following a fall in memory prices from the third quarter of 2022. Q1 2026: revenue W 52,576bn, cost of sales W 10,897bn, gross profit W 41,679bn, R&D W 2,451bn, profit W 40,346bn. — FY2023-FY2025 and Q1 2026 · publ. 2026-07-10 · source ↗
  4. Reported2023 revenue of ₩32,766bn against cost of sales of ₩33,299bn — a gross loss before research or overhead.
    SK hynix Inc., Form 424B4 prospectus — consolidated income statements and management's discussion (SEC, CIK 2120882). FY2025: revenue W 97,147bn, cost of sales W 38,456bn, gross profit W 58,691bn, selling and administrative expenses W 5,019bn, research and development W 6,466bn, profit for the year W 42,948bn. FY2024: revenue W 66,193bn, gross profit W 31,828bn, R&D W 4,436bn, profit W 19,797bn. FY2023: revenue W 32,766bn, cost of sales W 33,299bn, a gross loss of W 533bn, an operating loss of W 7,730bn and a loss for the year of W 9,138bn, following a fall in memory prices from the third quarter of 2022. Q1 2026: revenue W 52,576bn, cost of sales W 10,897bn, gross profit W 41,679bn, R&D W 2,451bn, profit W 40,346bn. — FY2023-FY2025 and Q1 2026 · publ. 2026-07-10 · source ↗
Sources
Generated September 23, 2026