Eight Generations, and 332 Layers ComingNarrow moat
Sandisk (SNDK) — moat facet
Eight generations in fifteen years, 332 layers sampling — and in NAND the layer count is not vanity, it is cost per bit and there is nothing else.
Eight generations of BiCS in about fifteen years, and the ninth and tenth are already in customers' hands as samples.
The current volume product is BiCS8, 218 layers, which put the CMOS logic directly beneath the array rather than beside it — a change that raised cell current by roughly 35%, NAND interface speed by about 60% and bit density by about 50% against the previous generation.1 BiCS9 is a derivative that keeps BiCS8's 218-layer cells and pairs them with a separate, faster CMOS logic wafer.
BiCS10 is the step that matters: 332 layers, a 4.8 Gbit/s interface using Toggle DDR6.0 and a separate command-address protocol, about 33% faster than BiCS8, and built by bonding three strings of 100-plus layers rather than etching a single 332-layer stack. Both Sandisk and Kioxia are sample shipping, and mass production is expected in 2027 at the Kitakami plant.2 A QLC version of the same technology would add roughly a third to chip capacity.
Layer count is not vanity in this industry. Cost per bit falls as bits per wafer rise, and bits per wafer rise with layers. It is the closest thing NAND has to a single scoreboard.
The cadence is the thing to judge, not the number. Sandisk and Kioxia have shipped a new generation roughly every two years for a decade and a half, sharing the development bill.
Watch the gap to Samsung at each node. It is at 400 layers today against BiCS10's 332, and a gap that persists across two generations becomes a cost gap.
BiCS10 at 332 layers is sample shipping from both partners with mass production expected at Kitakami in 2027, and K2 output began in fiscal 2026 — the capacity to run the node is new rather than converted.
About a third of the growth was volume and two-thirds price; new nodes should raise the volume share.
Source: Sandisk fiscal Q4 2026 results release (Exhibit 99.1, 5 August 2026) ↗- ReportedThe current volume product is BiCS8, 218 layers, which put the CMOS logic directly beneath the array rather than beside it — a change that raised cell current by roughly 35%, NAND interface speed by about 60% and bit density by about 50% against the previous generation. BiCS9 is a derivative that keeps BiCS8's 218-layer cells and pairs them with a separate, faster CMOS logic wafer.Sandisk Corporation, Form 10-K FY2026 — consolidated statements of operations, balance sheets and cash flows, and the results-of-operations and liquidity discussion in Item 7. Revenue net $20,248 million against $7,355 million and $6,663 million in the two prior years, up 175%; cost of revenue $5,776 million (28.5% of revenue); gross profit $14,472 million (71.5%, up 4,100 basis points); research and development $1,328 million (6.6%); selling, general and administrative $676 million (3.3%); loss on debt extinguishment $46 million; business separation costs $25 million; total operating expenses $2,083 million; operating income $12,389 million (61.3%); gain on equity securities $808 million; interest income $70 million; interest expense $73 million; other expense $177 million; income before taxes $13,017 million; income tax expense $1,584 million at a 12% effective rate (against negative 11% and negative 34%); net income $11,433 million (56.5%) against losses of $1,641 million and $672 million. Basic EPS $77.78 and diluted $73.76, on 147 million basic and 155 million diluted weighted average shares. Revenue by end market: Datacenter $5,153 million, $960 million and $325 million; Edge $12,160 million, $4,127 million and $4,069 million; Consumer $2,935 million, $2,268 million and $2,269 million. Revenue by geography: Asia $14,241 million, Americas $4,275 million, EMEA $1,732 million. Datacenter revenue rose 437% with products sold up almost 120% on an exabyte basis and revenue per gigabyte up almost 150%; Edge rose 195% with exabytes up a high single-digit percentage and revenue per gigabyte up almost 180%; Consumer rose 29% with exabytes DOWN a mid-teens percentage and revenue per gigabyte up a low-fifties percentage; total products sold increased by a mid-teens percentage on an exabyte basis. Sales incentive and marketing programmes represented 11%, 19% and 19% of gross revenues in 2026, 2025 and 2024. Balance sheet at 3 July 2026: cash and cash equivalents $4,762 million, accounts receivable $4,708 million, inventories $2,698 million, total current assets $12,780 million, marketable equity securities $1,777 million, property plant and equipment net $674 million, notes receivable and investments in Flash Ventures $678 million, goodwill $4,994 million, total assets $22,507 million; refund liabilities $1,500 million (from $126 million), contract liabilities $849 million current and $393 million non-current, income tax payable $1,286 million, total current liabilities $5,581 million, long-term debt nil (from $1,829 million), total liabilities $6,771 million, treasury stock $4,537 million, retained earnings $9,649 million (from an accumulated deficit of $1,784 million), total shareholders' equity $15,736 million, 149 million shares issued and 146 million outstanding. Cash flows: operating activities provided $11,671 million against $84 million and a use of $309 million; investing used $1,386 million including $970 million of purchases of marketable equity securities, $275 million of net issuances related to Flash Ventures and $177 million of capital expenditures; financing used $7,001 million including $4.5 billion of share repurchases, $1.9 billion of Term Loan repayments and settlement and $630 million of taxes on vested stock awards. Cash conversion cycle 162 days (DSO 48, DIO 178, DPO 64). $2,879 million of cash was held outside the US. Contract liabilities were $1,242 million and refund liabilities $1,500 million under long-term agreements. Unrecognised tax benefits were approximately $323 million. Tax holidays in Malaysia expire at various dates during 2028 through 2031. Total material cash requirements were $11,760 million, of which Flash Ventures-related commitments were $6,559 million and purchase obligations and other commitments $4,902 million. — FY2026 · publ. 2026-08-17 · source ↗
- ReportedBoth Sandisk and Kioxia are sample shipping, and mass production is expected in 2027 at the Kitakami plant. A QLC version of the same technology would add roughly a third to chip capacity.Coverage of Kioxia and Sandisk's BiCS10 3D NAND. BiCS10 is a 332-layer technology; the interface speed of 4.8 Gbit/s is 33 percent faster than BiCS8, achieved using the Toggle DDR6.0 interface and a Separate Command Address protocol. Mass BiCS10 production is expected to start in 2027 at the Kitakami plant 2 in Iwate Prefecture, Japan, and because Sandisk and Kioxia share the output of the fab through their joint venture both are sample shipping BiCS10 chips; a QLC version of the 332-layer technology would increase chip capacity by a third. The BiCS10 technology involves stacking three 100-plus layer NAND strings together rather than building a monolithic 332-layer chip. Kioxia has an intervening BiCS9 technology which uses BiCS8 218-layer 3D NAND cells with a separate CMOS logic layer providing more performance than the BiCS8 logic circuitry. For comparison, SK hynix has 321 layers in its ninth-generation 3D NAND, also using a triple string stack design; Samsung has 400 layers with its tenth-generation V-NAND, made with separate logic and NAND cell wafers producing a 1 Tbit die in what Samsung calls a Cell-on-Periphery architecture; Micron is at the 276-layer level; and China's YMTC is expected to announce 300-layer class technology. — 2026 · publ. 2026-07-03 · source ↗